To date, multiple system vendors have converged around Class 3-based solutions (Figure 1), recently announcing their next generation offerings. This industry convergence creates the benefit of economies of scale and broad industry investments into the technology used in this baud rate class, the same class being used for 800G MSA pluggable solutions.

Figure 1.  Acacia and other coherent vendors have announced Class 3 Terabit Era solutions.

Advancements Resulting in 65% Power-per-Bit Savings Over Current Competing Solutions
Doubling the baud rate from Class 2 to Class 3 in silicon was a significant engineering achievement, combining design advancements in high-speed Radio Frequency (RF) and Analog to Digital Converter (ADC) and Digital to Analog Converter (DAC) components plus well-designed co-packaging integration of silicon and silicon photonic (SiPh) components. These achievements led to Acacia’s successful 140Gbaud in-house capability that is being leveraged in the commercially available CIM 8 solution.

With high-volume shipments of multiple coherent Class 2 module products utilizing Acacia’s 3D Siliconization, this proven co-packaging integration solution provided the foundation for extending this capability to Class 3 140Gbaud implementation utilized in the CIM 8 (Figure 2). 3D Siliconization maximizes signal integrity by co-packaging all high-speed components including the coherent Digital Signal Processor (DSP) application-specific integrated circuit (ASIC), transmitter and receiver silicon photonics, and 3D stacked RF components into a single device that is manufactured in a standard electronics packaging house. Silicon technology has demonstrated cost and power advantages over alternative technologies, making it the material system of choice for these higher baud rates. These advancements enabling a doubling of the baud rate have led to a 65% power-per-bit savings of CIM 8 over current competing solutions that utilize alternative optical material systems. In addition, the size and power savings of this latest generation enabled the ability to house this 1.2T 140Gbaud solution in a pluggable form-factor.

Figure 2.  An example of 3D Siliconization used in the CIM 8 module, resulting in a volume electronics manufacturable high-speed single device larger than a quarter.

2^nd Generation 3D Shaping Advances Coherent Performance
The CIM 8 is powered by Jannu, Acacia’s 8^th generation coherent DSP ASIC. The design greatly expands on the success of the Pico DSP ASIC predecessor used in the widely deployed performance-optimized Class 2 AC1200 module (Figure 1). The AC1200 was the first module to introduce 3D Shaping, which provided finely tunable Adaptive Baud Rate up to 70Gbaud as well as finely tunable modulation up to 6 bits/symbol. The AC1200 had achieved record breaking spectral efficiency at the time of its introduction, as evidenced by a subsea trial over the MAREA submarine cable connecting Virginia Beach, Virginia to the city of Bilbao in Spain. Finely tunable baud rate helps maximize spectral efficiency in any given passband channel, converting excess margin into additional capacity/reach, and avoids wasted bandwidth due to network fragmentation.

Figure 3.  A popular feature is the fine-tunability of baud rate introduced by Acacia with the Class 2 AC1200; CIM 8 incorporates the same Adaptive Baud feature (as part of 2^nd Generation 3D Shaping) for Class 3 baud rate tunability.

The 5nm Jannu DSP ASIC in CIM 8 intelligently optimizes optical transmission using 2^nd Generation 3D Shaping with an increased Adaptive Baud Rate tunable range up to 140Gbaud, as well as finely tunable modulation up to 6 bits/symbol using enhanced Probabilistic Constellation Shaping (PCS). With 2^nd Generation 3D Shaping, the CIM 8 module can achieve a 20% improvement in spectral efficiency.

Terabit Era Solutions Provide Full Network Coverage
Class 3 technology not only ushers in the terabit era, but also enables full multi-haul network coverage as the high baud rate capabilities transport nx400GbE client traffic across a service provider’s entire network. Full network coverage is not only enabled by adjustment of the modulation, but also implies the capability to optimize for various network conditions which include overcoming transmission impairments.

Figure 4. CIM 8 1.2T, 1T, 800G, and 400G transmission constellations operating at Class 3 baud rates providing wide network coverage addressing multiple applications.

CIM 8 offers significant power-per-bit reductions as well as cost efficiencies for various optical network transport applications.

DCI/Metro Reaches
For transporting 3x400GbE or 12x100GbE client traffic with metro reaches in a single carrier, the CIM 8 is tuned to ~6 bits/symbol (equivalent to 64QAM, example constellation on left). Data center interconnect (DCI) applications would take advantage of this high-capacity 1.2T transport capability to tie data center locations together. This amounts to 38.4T per C-band fiber capacity.

Long-Haul Reaches

For transporting 2x400GbE with long-haul reaches, the CIM 8 is tuned to ~4 bits/symbol (equivalent to 16QAM, example constellation on the right). Wide 800G network coverage is achieved with the Class 3 140Gbaud capabilities enabling service providers to provide end-to-end 2x400GbE, 8x100GbE, or native 800GbE transport across their networks, covering essentially all terrestrial applications.

Ultra-Long-Haul/Subsea Reaches

And for ultra-long-haul/subsea reaches, the CIM 8 is tuned to ~2 bits/symbol (equivalent to QPSK, example constellation on the left). As with the previous scenarios, spectral efficiency with a wavelength channel is optimized by fine-tuning of the baud rate. These high spectrally efficient modes can carry mixed 100GbE and 400GbE traffic over the longest subsea routes in the world with lowest cost per bit. It’s worth noting that almost a decade ago, Acacia demonstrated SiPh capabilities for subsea coherent deployments. CIM 8 incorporates second generation non-linear equalization (NLEQ) capabilities to mitigate the non-linear effects of optical transmission especially for these ultra-long-haul/subsea links providing additional OSNR.

In all the above scenarios, the CIM 8 utilizes advanced power-efficient algorithms to compensate for chromatic and polarization dependent dispersion. In addition, the module accounts for coverage of aerial fiber network segments that require fast state-of-polarization (SOP) tracking and recovery due to lightning strikes. The SOP tracking speed of CIM 8 is double the speed of its predecessor. This fast SOP tracking feature can also be utilized for sensing applications.

Network Operators Achieve Record Breaking Field Trials with CIM 8
CIM 8 capabilities have already been put to the test as illustrated by multiple record breaking field trials across a wide range of applications. These include >5600km 400G transmission over a mobile carrier’s backbone network, 2200km 800G transmission over a research and education network, and >540km 1T transmission over a wholesale carrier’s network.

Acacia continues to demonstrate its technology leadership by leveraging mature knowledge in proven silicon-based coherent technology, producing the first shipping coherent solution to lead the industry into the Terabit Era with the 1.2T pluggable CIM 8 module. With the breakthrough capability of 140Gbaud transmission along with the advanced Jannu DSP ASIC using 2^nd Gen 3D Shaping and leveraging 3D Siliconization, network operators can support full network coverage for multi-haul applications, especially to support growing demands for nx400GbE and upcoming 800GbE traffic.

References:
Blog: Terabit Today: Maximize Network Coverage
Blog: How Industry Trends are Driving Coherent Technology Classifications
Blog Series: The Road Ahead for Next-Generation Multi-Haul Designs Part 1, Part 2, Part 3

At OFC 2022, there were several presenters discussing a new effort dubbed “coherent lite.” Roughly speaking, this term is used to convey a simplified implementation of coherent transmission for use in short reach campus and intra-DC applications. Compared to traditional transport DWDM applications, coherent lite removes unneeded features such as laser tunability and reduces complexity of impairment mitigation features such as dispersion compensation. Compared to alternative 800G and beyond solutions, coherent lite offers higher speed per wavelength, lower laser or fiber count, and better receiver sensitivity. By leveraging the continued trends of CMOS, the key components to build coherent-lite modules in a pluggable format are on par with alternative solutions with regards to power and size. The additional link budget available with a coherent implementation can be utilized to optimize the design for cost and power. These reasons make coherent lite a compelling solution for pluggable 800G and beyond in campus and intra-DC applications.

Figure 1.  Coherent solutions moving to shorter reaches as application data rates increase; pluggable modules leading the charge towards shorter reaches.

Coherent lite has been proposed for 800G campus network applications in both IEEE and the Optical Internetworking Forum (OIF), while some in the industry are already talking about coherent interfaces inside the data center at 1.6 Tbps. The OIF was the first to take action in this space, kicking off the 800LR project in late 2020 to pursue a solution for unamplified reaches of 2-10km using fixed wavelength coherent transmission. Hyperscale network operators are expected to be the first to adopt this technology due to their high bandwidth campus and intra-DC interconnect requirements. And as bandwidth demands increase to 1.6 Tbps intra-DC links, coherent lite solutions are expected to competitively address sub-2km reaches inside the data center.

Intra-Data Center Optical Interconnect Requirements

12.8Tbps Ethernet switches required 400G pluggable modules in QSFP-DD and OSFP form factors. 400ZR coherent optical transceivers, supporting these form factors, were developed for DCI edge network applications up to 120 km in reach. With switch capacity increasing to 25.6 Tbps, followed by 51.2 Tbps, optical transceivers are expected to migrate from 400 Gbps to 800 Gbps and then towards 1.6 Tbps speeds. Scaling the optical interconnect solutions to match these increasing port speeds can be challenging. While legacy-based intensity-modulated-direct-detect (IM-DD) solutions may continue to have a role for shorter intra-DC links at 800G, longer reach intra-DC applications benefit from coherent solutions. And at 1.6Tbps port speeds, coherent can become the preferred solution even for short intra-DC links.

Besides supporting growing port speeds, intra-DC optical interconnects at 800G and beyond are required to have low power consumption, high density, and support of high-volume deployments. To meet these requirements, modules can leverage advancements in low-power CMOS technology (which follows Moore’s Law), silicon photonics, and innovative packaging and integration solutions.

Another key intra-DC requirement is interoperability, which helps to drive broad industry adoption and higher volumes, thereby lowering supply chain risks for network operators. The importance of a robust supply chain has never been more important, and the higher volumes required for intra-DC applications make interoperability critical for coherent-lite adoption.

Coherent solutions have already proven capable of meeting these data center requirements of low power, high volume, and interoperability at 400G with the successful introduction of 400ZR modules. Coherent lite solutions are anticipated to chart a similar path for 800G and beyond.

Coherent Solutions for Intra-DC Applications

400G coherent pluggable transceiver solutions have proven that high-density, low-power coherent technology tailored to inter-data center switch/router interconnection applications are achievable. The industry has now embarked on a similar effort to bring to market cost-effective, high-volume coherent solutions optimized for campus and intra-DC applications.

Traditional intra-DC optical interconnects utilize IM-DD transmit/receive technology. Generational increases in link speed have required parallelization of fibers (e.g. 400G-DR4 using four fibers) or wavelengths (e.g., FR4 CWDM), as well advanced amplitude modulation schemes such as PAM4. While this aggregate approach has been successful to date, chromatic dispersion (CD) impairments begin to impact performance as the link speed requirement increases. Due to the square relationship between CD tolerance and the modulation baud rate, as you double each wavelength’s baud rate the CD tolerance is reduced by a factor of four. Alternatively, increasing the number of wavelengths pushes outer channels further from the fiber zero dispersion point resulting in having to mitigate this entire wavelength range to meet the link budget. Thus, even though the intra-DC distances are short, traditional IM-DD methods of increasing link capacity are expected to encounter challenges as intra-DC applications move to 800G and beyond.

Figure 2. IM-DD and Coherent proposed solutions to address 800LR applications.

Figure 2a illustrates a traditional IM-DD approach to address intra-DC and campus applications over a single-mode fiber pair, which for the 800G case multiple WDM lasers would be utilized to ensure sufficient link budget at this data rate.

IM-DD solutions are expected to be utilized for 800G intra-DC application reaches in the 2km range, while coherent technology would support 800G from 2km to 10km reaches. For optical platforms such as silicon photonics where a single laser’s power can be shared across multiple fibers, we expect the IM-DD solutions to remain attractive in those short, parallel fiber applications.

Coherent Lite Offers Cost-Optimized, Low Power Solution

In comparison to the IM-DD implementation, a coherent solution (Figure 2b) addressing the same 800LR link would achieve the target link budgets using one laser, and the improved sensitivity that is achieved using coherent detection. The laser capacity can be increased four-fold by utilizing the phase and polarization dimensions of light (I/Q modulation and polarization multiplexing). Using a single laser compared to four can result in cost and power improvements. In addition, the DSP in the coherent solution can mitigate dispersion effects as it would in a traditional transport solution but with a simpler implementation for a 2 to 10km reach.

Since intra-DC architectures do not need dense wavelength transmission in fiber, grey (fixed wavelength) lasers can be used, which greatly simplifies the design and reduces module cost.  Also, the extra available link budget due to higher receiver sensitivity can be used to lower the required laser power to reduce module power dissipation. In addition, coherent technology for high-capacity transport has traditionally required higher supplier capital expenditures on a per unit basis because of lower volume, more expensive test equipment required for the stringent specification requirements that drive the need for more comprehensive test coverage. Coherent lite intra-DC modules would be tested more like IM-DD client optics, resulting in substantial reduction in manufacturing capex with higher capacity.

These are some of the compelling reasons why the industry is looking toward coherent technology for shorter connections at 800G and beyond. Coherent lite 800LR pluggables can provide a competitive cost structure, while meeting campus and intra-DC requirements. This makes these solutions clear candidates for applications typically addressed by IM-DD solutions.

Opening the Doors to Coherent

400G coherent pluggable solutions have driven the momentum towards interoperable, high-volume solutions that are enabling coherent in campus and intra-DC applications at higher data rates, especially when utilizing a cost and power optimized coherent implementation. Compared to IM-DD, coherent offers a scalable path towards higher intra-DC data rates with more capacity per laser wavelength, higher receiver sensitivity, and digital equalization of impairments. In addition, the coherent lite solution may offer less technical risk and earlier market availability.

As requirements move beyond 800G towards 1.6T for intra-DC connections, dispersion impairments and link budget requirements are expected to be even more challenging for IM-DD solutions. Because of this, coherent-lite solutions are expected to be a strong contender for high-volume 1.6T intra-DC interconnect applications.

Network operators need to efficiently scale their networks to keep up with growing user bandwidth demands.  To meet this need, it is going to be increasingly important to develop next-generation solutions based on scalable technologies that are aligned with industry trends.

Trends Driving Coherent Optical Development

Coherent Moving to Shorter Reaches
As the industry moves to higher data rates, coherent is being adopted in shorter reach interfaces, which is increasing the share of coherent ports that are deployed in pluggable form factors. For example, the 400ZR specification targeted 80-120km reaches, and subsequently the OIF is now working on a project to define an 800LR that targets 10km and below. As this trend continues, it is likely that we’ll also see coherent move into the data center in future generations. These shorter reach interfaces tend to be higher volume than traditional transport applications, and as we look at this transition, it becomes more important to have interoperability and pluggable form factors that can plug directly into router interfaces.

Standardization is Key
The industry has been steadily moving to more standardization. 400G was a significant step forward and today we have a variety of standardized interfaces including 400ZR/ZR+ and Open ROADM – all of which are growing. These standardized interfaces are displacing both proprietary solutions in more traditional transport applications as well as direct detect solutions in shorter reach interfaces. Over time, most optical industry analysts agree that these standardized pluggable interfaces are expected to contribute a larger and larger portion of all the coherent ports in the industry.  Multi-haul solutions that address multiple applications will still be needed, but it will be important to align these multi-haul investments with standards.

Approaching the Shannon Limit
From a development perspective, incremental improvements in spectral efficiency are being made as we approach the Shannon Limit, but we need to find ways to grow network bandwidth more efficiently over time. In the past, we were able to scale the amount of data being transmitted over a single set of optics, while also increasing capacity on the fiber. Today, we are scaling as we increase baud rate, but the amount of data on the fiber is growing more incrementally. This is changing the way we develop products for the future and increasing baud rate cost-effectively is critical moving forward.

These three trends point to high-volume standardized solutions having a greater influence on next generation industry investment.

Coherent Technology Classifications

The below figure illustrates how coherent technology has evolved in response to growing bandwidth demands. Different baud rate classes are grouped based on technological capabilities, industry standardization (such as OIF, IEEE, Open ROADM, OpenZR+ MSA, CableLabs, ITU, IEEE) and common industry investments. Throughout this evolution, it has been critical that each successive class support similar reaches to the previous class.

Baud rate has doubled for each coherent technology class.

Class 1
There was a long period during the early days of coherent technology development with multiple investment nodes. At 30-34 Gbaud, there were 100G and 200G products and the industry made a significant investment at this stage. In this generation, there was widespread standardization of components such as modulators and receivers. However, standardized optical interfaces sacrificed significant performance compared to proprietary implementations, so they were not widely adopted.

Class 2
This is where the industry is today, and it is during this stage that standardized optical interfaces are being widely deployed for the first time. The first Class 2 products were proprietary interfaces supporting multi-haul applications in embedded module form factors. Later, 400G faceplate pluggables, driven by standardization efforts that drove heavy investments into products centered around 16QAM, 60+Gbaud per 75GHz channel transmission were introduced with strong industry adoption. When we migrated to Class 2, we doubled the baud rate and enabled an increase in the data rate.

Class 3
These products once again represent a doubling of baud rate compared to the class before it, with products migrating to 120-136 Gbaud. This approach of doubling baud rate is utilized in standards because it allows for this doubling of data rate using the same modulation format as the previous class. 4 bits/symbol was chosen for 400G standards because it supports a wide range of applications. When scaling from 400G to 800G, doubling the baud rate is the logical path forward.

Class 4
These products will continue the trend we saw in the earlier classes where the model is to increase baud rate but take additional steps to cover all applications. Like earlier trends, we expect the baud rate to also double from Class 3 to Class 4 products, while utilizing the same modulation order.

“These classifications basically mirror industry investment cycles, which is absolutely the right way to align coherent technology development around,” said Alan Weckel, Founder and Technology Analyst at 650 Group. “At the end of the day, operators need solutions to be cost effective and the best way to do that is to leverage the investment across all the various applications and benefit from higher volume production and scale. Increasingly coherent ports are moving to pluggable form factors and as we approach the Shannon Limit, further improvement in cost will come from going to higher baud rates, but in cost effective way.”

Acacia’s Class 3 Solution
Acacia’s recently announced Coherent Interconnect Module 8 (CIM 8)  is a Class 3 solution that can address transmission of multiple 400GbE client interfaces over virtually any network application, delivering 1.2T per carrier capacity for high-capacity DCI interfaces and 800G per carrier capacity over most optical links using 4 bits/symbol (~16QAM) modulation. This product supports 150GHz channels with double the capacity per carrier and longer reach than that of the previous class, providing a simple, scalable path that is compatible with the previous network architecture generation.

Acacia’s CIM 8 is the industry’s first 1.2 faceplate pluggable coherent module, powered by Acacia’s Jannu 5nm CMOS digital signal processor (DSP) ASIC. This solution delivers industry-leading performance with single carrier 1.2T operation and combines the Jannu DSP with 3D Siliconization packaging technology which includes the silicon photonics integrated circuit (SiPh PIC), high-speed modulator driver and transimpedance amplifier (TIA) in a single opto-electronic package. With 3D Siliconization, the high-speed RF interfaces are tightly coupled together, resulting in improved signal integrity for high baud rate signals. The high-density packaging as well as an advanced high-speed modulator design that enables the 140Gbaud performance as explained in this white paper.

The Future of Coherent Development

As the coherent technology classifications chart highlights above, the industry has undergone several large investment phases.  This has been good for the industry because it allowed vendors to have a significant ROI, worked well with network operator upgrade cycles, and avoided many small iterative steps in between. However, moving forward it is going to be important to align with these industry investments. As a result, we need to think about how to develop solutions that scale to high volume in a power-efficient and cost-effective way. Silicon photonic based coherent interfaces have proven to be successful in meeting these challenges generation after generation and we believe this technology can continue to help effectively meet bandwidth demands of the future.